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Lead-free solder wetting agent "Futagent"

Reduce solder joint defects! Fluorine-based wetting agent for lead-free solder.

The lead-free solder wetting agent "Futagent" improves the wetting spreadability of solder by adding it to the flux (filler) component. By reducing solder joint defects, it contributes to improved yield. The recommended addition amount is 0.1 wt% (active ingredient) relative to the flux. It is fluorine-based and does not fall under PFOS or PFOA. The wetting properties of solder are good when using flux with added Futagent. 【Features】 ○ For lead-free solder ○ Added to the flux (filler) component ○ Reduces solder joint defects ○ Contributes to improved yield ○ Fluorine-based, not applicable to PFOS or PFOA For more details, please contact us or download the catalog.

  • Coating Agent
  • Chemicals

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